Electronic component package and method of manufacturing the same

ABSTRACT

An electronic component package includes first and second wiring parts including insulating layers, conductive patterns formed in the insulating layers, and conductive vias penetrating through the insulating layers, to be connected to the conductive patterns, respectively; a frame disposed between the first and second wiring parts and having conductive connection parts electrically connecting one or more through-holes with the first and second wiring parts and an electronic component disposed to be surrounded by the through-hole, to thereby be connected to the first wiring part, wherein the conductive patterns formed to be adjacent to the electronic component among the conductive patterns of the first wiring part are embedded in the insulating layer of the first wiring part.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application claims the benefit of priority to Korean PatentApplication No. 10-2016-0008249, filed on Jan. 22, 2016 in the KoreanIntellectual Property Office, the entire disclosure of which isincorporated herein by reference.

BACKGROUND

1. Technical Field

The present disclosure relates to an electronic component package and amethod of manufacturing the same.

2. Description of Related Art

An electronic component package serves to protect electronic componentsfrom external shocks while electrically connecting the electroniccomponents to a printed circuit board (PCB), for example, a main boardof an electronic device. One of the recent trends in the development oftechnology related to electronic components has been to reduce the sizeof the components. In addition to this trend toward increased demand forsmaller electronic components, there has also been increased demand forthe implementation of a plurality of pins in components having a smallsize in the technical field of electronic component packaging.

In order to satisfy the technical demand as described above, a waferlevel package (WLP) may be implemented, which uses the rewiring of theelectrode pad of an electronic component formed on a wafer. Examples ofwafer level packages include fan-in wafer level packages and fan-outwafer level packages. In particular, since fan-out wafer level packagesare useful in terms of implementing a plurality of pins whilemaintaining a small size, fan-out wafer level packages have recentlybeen actively developed.

When such a package is manufactured, an electrical test for detectingwhether or not the package is faulty is required. Conventionally, theelectrical test is performed after the electronic component is mountedon a board, such as an integrated circuit (IC) chip. As such, in thecase in which the electrical test is performed on an already-mountedelectronic component, when a fault occurs, the electronic component, inaddition to the wiring layer forming the package, is no longer usable,leading to significantly large losses for manufacturers.

SUMMARY

An aspect of the present disclosure provides an electronic componentpackage having a compact structure while including a plurality ofelectronic components, having significantly improved manufacturingefficiency through electrical tests being performed on wiring partsbefore the electronic components are mounted.

Another aspect of the present disclosure provides a manufacturing methodallowing the electronic component package described above to beefficiently manufactured.

According to an aspect of the present disclosure, an electroniccomponent package includes: first and second wiring parts including aninsulating layer, a conductive pattern formed in the insulating layer,and a conductive via penetrating through the insulating layer to beconnected to the conductive pattern, respectively; a frame disposedbetween the first and second wiring parts and having conductiveconnection parts electrically connecting one or more through-holes withthe first and second wiring parts; and an electronic component disposedto be surrounded by the through-hole to thereby be connected to thefirst wiring part, wherein the conductive patterns formed to be adjacentto the electronic component among the conductive patterns of the firstwiring part may be embedded in the insulating layer of the first wiringpart.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other aspects, features and other advantages of thepresent disclosure will be more clearly understood from the followingdetailed description when taken in conjunction with the accompanyingdrawings, in which:

FIG. 1 is a block diagram schematically illustrating an exemplaryembodiment of an electronic device system;

FIG. 2 schematically illustrates an exemplary embodiment of anelectronic component package applied to an electronic device;

FIG. 3 is a cross-sectional view schematically illustrating an exemplaryembodiment of the electronic component package;

FIGS. 4 through 8 schematically illustrate a manufacturing method of anelectronic component package according to an exemplary embodiment in thepresent disclosure;

FIGS. 9 through 12 schematically illustrate an electronic componentpackage and a manufacturing method of the same according to anotherexemplary embodiment in the present disclosure; and

FIG. 13 is a cross-sectional view schematically illustrating anotherexemplary embodiment of the electronic component package.

DETAILED DESCRIPTION

Hereinafter, exemplary embodiments in the present disclosure will bedescribed in detail with reference to the accompanying drawings.

Electronic Device

FIG. 1 is a block diagram schematically illustrating an example of anelectronic device system. Referring to FIG. 1, an electronic device 1000may accommodate a main board 1010. The main board 1010 may be physicallyand/or electrically connected to chip-related components 1020,network-related components 1030, and other components 1040. Thesecomponents may be coupled to other components, to be described below, toform various signal lines 1090.

The chip-related components 1020 may include a memory chip such as avolatile memory (e.g., a dynamic random access memory (DRAM)), anon-volatile memory (e.g., a read only memory (ROM)), a flash memory, orthe like; an application processor chip, such as a central processor(e.g., a central processing unit (CPU)), a graphics processor (e.g., agraphics processing unit (GPU)), a digital signal processor, acryptographic processor, a micro processor, a micro controller, or thelike; a logic chip, such as an analog-to-digital (ADC) converter, and anapplication-specific integrated circuit (ASIC), or the like. However,the chip-related components 1020 are not limited thereto, but may alsoinclude other types of chip-related components. In addition, thesechip-related components 1020 may be combined with each other.

The network-related components 1030 may include wireless fidelity(Wi-Fi) (Institute of Electrical and Electronics Engineers (IEEE) 802.11family, or the like), Worldwide Interoperability for Microwave Access(WiMAX) (IEEE 802.16 family, or the like), IEEE 802.20, Long TermEvolution (LTE), Evolution Data Only (Ev-DO), High Speed Packet Access+(HSPA+), High Speed Downlink Packet Access+ (HSDPA+), High Speed UplinkPacket Access+ (HSUPA+), Enhanced Data GSM Environment (EDGE), GlobalSystem for Mobile Communications (GSM), Global Positioning System (GPS),General Packet Radio Service (GPRS), Code Division Multiple Access(CDMA), Time Division Multiple Access (TDMA), Digital Cordless Telephone(DECT), Bluetooth, 3G, 4G, 5G protocols and any other wired and wirelessprotocols designated as those following the above-mentioned protocols.However, the network-related components 1030 are not limited thereto,but may also include any of a plurality of other wireless or wiredstandards or protocols. In addition, these network-related components1030 may be combined with each other or with the chip-related components1020 described above.

Other components 1040 may include a high frequency inductor, a ferriteinductor, a power inductor, ferrite beads, low temperature co-firedceramics (LTCC), an electromagnetic interference (EMI) filter, amultilayer ceramic capacitor (MLCC), and the like. However, othercomponents 1040 are not limited thereto, but may also include passivecomponents used for various other purposes and the like. In addition,these other components 1040 may be combined with each other or with thechip-related components 1020 and/or the network-related components 1030described above.

Depending on a kind of the electronic device 1000, the electronic device1000 may include other components, which may be physically and/orelectrically connected to the main board 1010 or not. Such othercomponents may include, for example, a camera 1050, an antenna 1060, adisplay 1070, a battery 1080, an audio codec (not shown), a video codec(not shown), a power amplifier (not shown), a compass (not shown), anaccelerometer (not shown), a gyroscope (not shown), a speaker (notshown), a mass storage device (e.g., a hard disk drive) (not shown), acompact disk (CD) drive (not shown), and a digital versatile disk (DVD)drive (not shown). However, such other components are not limitedthereto, but may also include other components used for variouspurposes, depending on the kind of the electronic device 1000.

The electronic device (1000) may be a smartphone, a personal digitalassistant, a digital video camera, a digital still camera, a networksystem, a computer, a monitor, a tablet, a laptop, a netbook, atelevision, a video games console, a smartwatch, and the like. However,the electronic device 1000 is not limited thereto, and may be any otherelectronic device for processing data, in addition to those mentionedabove.

FIG. 2 schematically illustrates an example of an electronic componentpackage applied to an electronic device. The electronic componentpackage may be applied to various electronic devices 1000 as describedabove for various purposes. For example, the main board 1110 may beaccommodated within a body 1101 of the smartphone 1100, and variouselectronic components 1120 maybe physically and/or electricallyconnected to the main board 1110. In addition, other components whichmay be physically and/or electrically connected to the main board 1010,or not, such as the camera 1130, maybe accommodated within the body1101. In this case, some of the electronic components 1120 may be thechip-related components 1020 as described above, and the electroniccomponent package 100 may be, for example, the application processoramong the chip related components, but is not limited thereto.

Electronic Component Package and Manufacturing Method of the Same

FIG. 3 is a cross-sectional view schematically illustrating theelectronic component package according to an exemplary embodiment. Theelectronic component package 100, according to the present exemplaryembodiment, may include a first wiring part 110, a frame 120, anelectronic component 130, and a second wiring part 140, as maincomponents.

The first wiring part 110 may be provided as amounting region of theelectronic component 130, and may be electrically connected to theelectronic component 130. The first wiring part 110 may include aninsulating layer 111, a conductive pattern 112, and a conductive via113, and may perform a function of rewiring a wiring structure of theelectronic component 130. Although FIG. 3 illustrates an example inwhich the first wiring part 110 has a multilayer structure, the firstwiring part 110 may also be formed in a single layer. In addition, thefirst wiring part 110 may also have more layers, according to a designspecification.

Insulating materials which may be used in the insulating layer 111include a thermosetting resin such as an epoxy resin, a thermoplasticresin such as polyimide, a resin having a reinforcement material such asa glass fiber or an inorganic filler impregnated therein, for example, aprepreg, Ajinomoto Build-up Film (ABF), FR-4, a bismaleimide triazine(BT) resin, or the like. In addition, in a case in which a photo curablematerial (PID) is used as the insulating material, the insulating layer111 may be formed to be thinner, and a fine pattern may be more easilyimplemented. The insulating layer 111 forming each of the layers in thefirst wiring part 110 may be formed of the same material, or it may alsobe formed of different materials. A thickness of the insulating layer111 is not particularly limited, and for example, each of the layers mayhave a thickness of about 5 μm to 20 μm when a thickness of theconductive pattern 112 is excluded, and about 15 μm to 70 μm when thethickness of the conductive pattern 112 is considered.

The conductive pattern 112 may serve as a wiring pattern and/or a padpattern, and may be formed of a conductive material such as copper (Cu),aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb),or alloys thereof. The conductive pattern 112 may perform variousfunctions depending on a design of the corresponding layer. For example,the conductive pattern 112 may serve as a ground pattern, a powerpattern, a signal pattern, or the like, or as a rewiring pattern. Here,the signal pattern may transmit and receive a variety of signals,excluding signals for the ground pattern, the power pattern, and thelike, for example, a data signal, or the like. In addition, theconductive pattern 112 may serve as a via pad, an external connectionterminal pad, a pad pattern, or the like. A thickness of the conductivepattern 112 is also not particularly limited, and may be, for example,about 10 μm to 50 μm.

According to the present exemplary embodiment, conductive patterns P,formed to be adjacent to the electronic component 130 among theconductive patterns 112 of the first wiring part 110, may be provided bybeing embedded in the insulating layer 111. In this case, the conductivepatterns P adjacent to the electronic component 130 may be theconductive patterns which are directly connected to the electroniccomponent 130. In addition to this, the conductive patterns 112 may alsoinclude additional conductive patterns 112. These conductive patterns112 are at the same level as the conductive patterns P, which aredirectly connected to the electronic component 130, and are directlyconnected to the frame 120. Since the above-mentioned embedded patternsP have a lower possibility of short-circuits being generated than otheradjacent patterns, compared to a pattern having a protruding shape, theymay be formed at a relatively narrow interval. That is, the conductivepatterns P adjacent to the electronic component 130 among the conductivepatterns 112 may be implemented to have a smaller pitch than those whichare not adjacent to the electronic component 130. As such, a finepattern may be implemented by the embedded patterns P adjacent to theelectronic component 130, whereby advantages such as an improvement ofmounting density of the electronic component 130, slimness of thepackage, and the like may be provided.

Furthermore, a surface treatment layer may be formed on the conductivepatterns of the insulating layer 111 among the conductive patterns 112that are exposed externally, for example, among the conductive patternsconnected to the electronic component 130. The surface treatment layeris not particularly limited, as long as it is known in the art, and maybe formed by, for example, electrolytic gold plating, electroless goldplating, OSP or electroless tin plating, electroless silver plating,electroless nickel plating/displacement gold plating, direct immersiongold (DIG) plating, hot air solder leveling (HASL), and the like.

The conductive via 113 may electrically connect the conductive patterns112 to each other, even if they are formed on different layers, and,consequently, may form an electrical path within the package 100. Theconductive via 113 may also be formed of a conductive material such ascopper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel(Ni), lead (Pb), or alloys thereof. The conductive via 113 may be fullyfilled with a conductive material or the conductive material may beformed along a wall of the via. In addition, regarding the shape of theconductive via 113, any shape commonly known in the art may be used,such as a taper shape, in which a diameter is decreased toward a lowersurface of the via, an inverse taper shape in which the diameter isincreased toward the lower surface of the via, a cylindrical shape, andthe like.

The frame 120, which serves to support the package 100, may maintainhardness and secure uniformity of thickness. The frame 120 may includeone or more through-holes, and the electronic component 130 may bepositioned within the through-holes. A material forming the frame 120 isnot particularly limited, a molding resin or a prepreg, possibly ametal, or a ceramic-based material maybe used. For example, as describedbelow, the frame 120 may be bonded to the first wiring part 110 after ahole is machined in the prepreg. To this end, an adhesive layer 123 maybe interposed between the frame 120 and the first wiring part 110. Inthis case, the adhesive layer 123 may be formed of a material includinga prepreg, a solder resist, and the like.

According to the present exemplary embodiment, a conductive connectionpart 122, penetrating through the frame 120 to be connected to the firstand second wiring parts 110 and 140, may be formed in the frame 120. Asan example, as illustrated in FIG. 3, the conductive connection part 122of the frame 120 may be provided to be connected to the conductivepattern 112 of the first wiring part 110 and to conductive patterns 121formed on an upper portion and a lower portion of the frame 120. Theconductive connection part 122 may be implemented using a process suchas plating or the like to fill the hole after machining the hole in theframe 120, or may be implemented in a form of a conductive post. Withregard to a shape of the conductive connection part 122, as illustratedin FIG. 3, the conductive connection part 122 may have a shape in whicha width is decreased from upper and lower surfaces of the frame 120 toan inside of the frame 120. The above-mentioned shape of the conductiveconnection part 122 may be achieved by machining the hole in the upperportion and the lower portion of the frame 120, respectively, and may besuitable for a method for bonding the frame 120 to the first wiring part110, as described below with reference to a manufacturing process.

The electronic component 130 may include various active components(e.g., a diode, a vacuum tube, a transistor, etc.) or passive components(e.g., an inductor, a condenser, a resistor, etc.). Alternatively, theelectronic component 130 may be an integrated circuit (IC) chip in whichhundreds to millions or more elements are integrated in one chip. Inaddition, the IC chip may also be an electronic component which ispackaged in flip chip form. The IC chip may be, for example, anapplication processor chip, such as a central processor (e.g., a centralprocessing unit (CPU)), a graphics processor (e.g., a graphicsprocessing unit (GPU)), a digital signal processor, a cryptographicprocessor, a micro processor, a micro controller, or the like, but isnot limited thereto. In this case, although FIG. 3 illustrates a form inwhich just one electronic component 130 is mounted on the first wiringpart 110, two or more electronic components may also be used.

The electronic component 130 may include one or more electrode pads 131which are electrically connected to the first wiring part 110, and, asin the exemplary embodiment illustrated in FIG. 3, the electroniccomponent 130 may be mounted in a manner such that the electrode padsincluded in the electronic component 130 are connected to the firstwiring part 110. The electronic component 130 may be rewired by thefirst wiring part 110. To this end, the conductive patterns 112 of thefirst wiring part 110 and adhesive and electrical connection parts 132,such as a solder or the like, may be interposed between the electroniccomponent 130 and the first wiring part 110. In addition, in order tomount the electronic component 130 stably, an adhesive part 133, formedof an underfill resin or an insulating epoxy, may be interposed betweenthe electronic component 130 and the first wiring part 110. However, theadhesive part 133 may be appropriately modified or excluded according toexemplary embodiments. A thickness of a cross section of the electroniccomponent 130 is not particularly limited, and may be varied, dependingon a kind of electronic component 130. For example, in a case in whichthe electronic component is the IC chip, the thickness in the crosssection thereof may be about 100 μm to 480 μm, but is not limitedthereto.

An encapsulant 134, which may serve to protect the electronic component130 and the like, may be filled in the through-holes of the frame 120. Amaterial forming the encapsulant 134 is not particularly limited as longas it serves to protect the electronic component. For example, as theencapsulant 134, a thermosetting resin such as an epoxy resin, athermoplastic resin such as polyimide, or a resin having a reinforcementmaterial such as a glass fiber or an inorganic filler impregnatedtherein, for example, a prepreg, ABF, FR-4, BT, a PID resin, or the likemay be used. In addition, the encapsulant 134 may be obtained bystacking a resin film in an uncured state on the first wiring part 110and then curing the stacked resin film, or, in addition to this method,a known molding method such as EMC or the like may also be used.

In order to block electromagnetic waves, the encapsulant 134 may furtherinclude conductive particles. Any conductive particles may be used aslong as they are able to block the electromagnetic waves. For example,the conductive particles may be formed of copper (Cu), aluminum (Al),silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), a solder, orthe like, but these are merely examples and the particles' compositionis not limited thereto.

The second wiring part 140 may be disposed on the electronic component130 and the frame 120, and an additional electronic component or packagemay be disposed on the second wiring part 140. Similar to the firstwiring part 110, the second wiring part 140 may include an insulatinglayer 141, a conductive pattern 142, and a conductive via 143. Thesecond wiring part 140 may electrically connect the electroniccomponent, the package, other elements and the like, to each other, andmay also serve to rewire an electrical wire of a component disposed onan upper portion thereof, in some cases. In this case, the second wiringpart 140 may be formed to be thinner than the first wiring part 110. Forexample, as illustrated in FIG. 3, the first wiring part 110 may containa larger number of insulating layers 111 than are contained in thesecond wiring part 140. However, this is an example and the presentdisclosure is not limited thereto.

An external layer 150, which may protect the first wiring part 110 andthe second wiring part 140 from external physical and chemical impacts,may be formed on the lower portion of the first wiring part 110 and onan upper portion of the second wiring part 140, although not shown. Inthis case, the external layer 150 may have an opening exposing at leasta portion of the conductive patterns 112 and 142. A material forming theexternal layer 150 is not particularly limited, and, for example, asolder resist may be used. In addition, the external layer 150 may beformed of the same material as the insulating layers of the first andsecond wiring parts 110 and 140. Further, the external layer 150 may bea single layer, or it may also be formed in multiple layers.

A connection terminal 151 may be formed below the electronic componentpackage 100. The connection terminal 151 may be a configuration forphysically and/or electrically connecting the electronic componentpackage 100 to the outside. For example, the electronic componentpackage 100 may be mounted on the main board of the electronic devicethrough the connection terminal 151. The connection terminal 151 may beconnected to the conductive pattern 112 through the opening formed inthe external layer 150, and, as a result, may be electrically connectedto the electronic component 130. The connection terminal 151 maybeformed of a conductive material, for example, copper (Cu), aluminum(Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), asolder, or the like, but this is merely an example and the material ofthe connection material 151 is not particularly limited thereto. Theconnection terminal 151 may be a land, a ball, a pin, or the like. Theconnection terminal 151 may be formed in multiple layers or a singlelayer. In the case in which the connection terminal 151 is formed inmultiple layers, the connection terminal 151 may include copper (Cu)filler and a solder, and in the case in which the connection terminal151 is formed in a single layer, the connection terminal 151 may includea tin-silver solder or copper (Cu). However, these are merely examples,and the material included in the connection terminal 151 is not limitedthereto.

A portion of the external connection terminal 151 may be disposed on afan-out region. The fan-out region is a region outside of a region inwhich the electronic component is disposed. That is, the electroniccomponent package 100, according to an exemplary embodiment, maybe afan-out package. The fan-out package may have excellent reliability, mayimplement a plurality of I/O terminals, and may easily perform a 3Dinterconnection, compared to a fan-in package. In addition, compared toa ball grid array (BGA) package, a land grid array (LGA) package, andthe like, since the fan-out package may be mounted on the electronicdevice without using a separate substrate, the package may bemanufactured to have a thin thickness, and price competitiveness may beexcellent.

The electronic component package 100 described above may implement aplurality of electronic components in a single package having a compactsize, and may also be a structure suitable for performing a partialelectrical test before mounting the electronic components. Accordingly,unnecessary consumption of the electronic component 130, which isrelatively expensive among components of the package, may be reduced.That is, in a case in which the electrical test is performed aftermounting the electronic components 130, there may be a problem in whichthe electronic components are not able to be used, even though the faultoccurred in the wiring parts rather than in the electronic components.Hereinafter, a manufacturing method of an electronic component packagehaving the structure described above will be described. A packagestructure according to the exemplary embodiments or the modified exampledescribed above may be more clearly understood by a description of themanufacturing method.

FIGS. 4 through 8 schematically illustrate a manufacturing method of anelectronic component package according to an exemplary embodiment in thepresent disclosure.

First, as illustrated in FIG. 4, the frame 120, having the through-holeH, may be prepared. To this end, a copper clad laminate (CCL) or thelike may be used. More specifically, a process of forming a conductiveconnection part 122 by machining the hole in the frame 120 and fillingthe hole with the conductive material, a process of forming theconductive pattern 121 by patterning a metal thin film, a process offorming the through-hole H in the frame 120, and the like may beexecuted. Here, in the case of the process of machining the hole in theframe 120, a laser or mechanical machining method may be used for theupper and lower portions of the frame 120, respectively. Similarly, thethrough-hole H, provided as a region accommodating the electroniccomponent, may be formed by performing laser or mechanical machining onthe frame 120.

Independent from or at the same time as the processes of FIG. 4, thefirst wiring part 110 may be formed on a first support 160, asillustrated in FIG. 5. The purpose of the first support 160 is toprovide a support for the first wiring part 110 having a relative thinthickness, and a material which may be used in the first support 160 isnot particularly limited, as long as it serves to support the firstwiring part 110. The first support 160 maybe a multilayer structure, andmay include a release layer, a metal layer, or the like, so as to beeasily removed together with the first wiring part 110 in the subsequentprocess. According to the present exemplary embodiment, an electricaltest for the first wiring part 110 may be performed in a state in whichthe first support 160 is coupled to the first wiring part 110.Specifically, as illustrated in FIG. 5, a test jig 171 may be connectedto the conductive pattern 112 over the first wiring part 110. In thiscase, the test jig 171 may include a plurality of tips 172, and theplurality of tips 172 may be disposed at positions corresponding to atleast some of the conductive patterns 112. Since whether or not thefirst wiring part 110 is faulty may be identified in advance byperforming the electrical test before mounting the electronic component,unnecessary consumption of the electronic component may be significantlyreduced. That is, the first wiring part 110 which is judged as faulty inthe present test process maybe discarded or reused for other purposes,and the subsequent process does not need to be performed, therebyreducing process costs. The first wiring part 110 may include anadditional structure such as a daisy chain for the electrical test.Accordingly, the electrical test may be performed through the upperportion of the first wiring part 110, even in a state in which the firstsupport 160 is bonded to the lower portion of the first wiring part 110.

In order to implement the first wiring part 110, the insulating layer111, the conductive pattern 112, and the conductive via 113 may beformed to be matched to an intended shape, which may be repeated as manytimes as necessary. Specifically, the insulating layer 111 may be formedby a known method, and may be formed by, for example, a method oflamination and then curing, or an application and curing method, and thelike. As the lamination method, for example, a method of separating aworking tool by cooling the insulating layer in a cold press, after ahot press, in which the insulating layer is compressed for apredetermined time at a high temperature and is then decompressed to becooled to a room temperature, may be used. As the application method,for example, a screen printing method in which ink is applied bysqueezing it onto a surface, a spray printing method in which the ink ismisted and applied, and the like may be used. The curing may refer todrying the insulating layer so as not to be fully cured in order to thenuse a photolithography method, or the like, as a post-process.

Next, as illustrated in FIG. 6, the first wiring part 110 maybe bondedto a second support 161, and the first support 160 may be separated fromthe first wiring part 110. Specifically, after the second support 161 isdisposed on the upper portion of the first wiring part 110, in relationto FIG. 5, the first support 160 on the lower portion of the firstwiring part 110 may be separated, which is illustrated in FIG. 6.Another support 161 is bonded to the first wiring part 110 so as toimplement the conductive patterns 112, exposed on the first wiring part110, in a form of embedded patterns P, and to dispose the electroniccomponent on the embedded patterns P.

Next, as illustrated in FIG. 7, the frame 120 and the first wiring part110, described in relation to FIG. 4, may be connected to each other.Specifically, the frame 120 may be disposed on the first wiring part110, and the frame 120 and the first wiring part 110 may be bonded toeach other. In this case, a position of the frame 120 may be adjusted sothat the through-hole H is disposed in a region corresponding to theembedded patterns P on which the electronic component is to be disposed.

In order to bond the first wiring part 110 and the frame 120 to eachother, the adhesive layer 123 formed of a non-conductive material or thelike may be interposed between the first wiring part 110 and the frame120. However, the first wiring part 110 and the frame 120 may bedirectly bonded to each other without interposing the adhesive layer123. In addition, although the present exemplary embodiment describes anexample in which the frame 120 is bonded to the first wiring part 110 ina state in which the through-hole has been formed in the frame 120, thehole may also be machined in the frame 120 in a state in which the frame120 is bonded to the first wiring part 110, in some cases.

Next, as illustrated in FIG. 8, the electronic component 130 may bedisposed and mounted on the first wiring part 110. In this case, theelectronic component 130 may be disposed so that the electrode pad 131is directed toward the first wiring part 110. A detailed description ofthe adhesive electrical connection part 132 and the adhesive part 133which may be provided for mounting the electronic component will beomitted. After the electronic component 130 is mounted, the encapsulant134 may be formed to be filled in the through-hole. As an example offorming the encapsulant 134, a method of stacking a resin film of anuncured state on the first wiring part 110 and then curing the stackedresin film, or an EMC molding method, may be used.

The second support 161 may be removed in a state in which the frame 120is attached to the first wiring part 110. Additionally, an etchingprocess and a desmearing process used in the art may be appropriatelyutilized. However, the first support 161 does not need to be removed inthe present operation, and may also be removed in a subsequent processor prior to the present operation.

Next, the electronic component package 100 illustrated in FIG. 3 may beobtained by forming the second wiring part 140 on the frame 120. Thesecond wiring part 140 may include one or more insulating layers 141,with the conductive patterns 142 formed on the insulating layers 141 andthe conductive via 143 penetrating through the insulating layers 141,and may be obtained by the same method as the first wiring part 110described above.

Although not illustrated, an additional electronic component or packagemay be disposed on the second wiring part 140 in order to improveperformance of the package 100 or expand an additional function. Aso-called package on package (POP) structure may be obtained bydisposing the additional electronic component described above.

Hereinafter, a structure of an electronic component and a manufacturingmethod of the same, according to another exemplary embodiment in thepresent disclosure, will be described with reference to FIGS. 9 through12. The present exemplary embodiment is different from or illustrates inmore detail the exemplary embodiments described above in a method offorming a through-hole and a conductive connection part in the frame,and may also be applied to the exemplary embodiments described aboveunless otherwise described. More specifically, in the exemplaryembodiment described above, the frame may be implemented by machiningthe CCL. In the present exemplary embodiment, the frame may be formedusing a typical substrate process of stacking a plurality of insulatinglayers, for example, prepregs.

First, as illustrated in FIG. 9, an etch stop layer 264 may be formed ona first support 260. According to the present exemplary embodiment, thefirst support 260 may include a release layer 261 and a metal thin film262 formed on a surface thereof. However, the release layer 261 and themetal thin film 262 included in the first support 260 may also beexcluded. The etch stop layer 264 may be formed by plating nickel (Ni)or the like. To this end, a mask 263 having an appropriate shape may beused. In this case, in order to easily remove the etch stop layer 264 inthe subsequent process, the release layer may be interposed between thefirst support 260 and the etch stop layer 264.

As described below, the purpose of the etch stop layer 264 is tosignificantly reduce damage to the conductive patterns in the process offorming the through-hole in the frame. A shape of the etch stop layer264 may be determined by considering a region on which the electroniccomponent is mounted. Depending on the exemplary embodiments, the etchstop layer 264 may be retained in a region around the through-hole inthe package, and since the etch stop layer 264 may not be provided, toallow for an electrical connection, the etch stop layer 264 may beelectrically isolated from the electronic component.

Next, as illustrated in FIG. 10, a frame 220, along with conductivepatterns 221 and conductive connection parts 222 included in the frame220, may be formed on the first support 260 which may be previouslymachined. According to the present exemplary embodiment, the frame 220may have a multilayer structure, and may be obtained, for example, bystacking a plurality of prepregs. In this case, as illustrated in FIG.10, the conductive connection parts 222 may be formed to penetratethrough the respective layers of the frame 220 having the multilayerstructure, and the conductive connection part 222 of each of the layersmay have a conical shape, in which a width is decreased from an upperportion of the conductive connection part 222 to a lower portionthereof. This shape of the conductive connection part 222 maybe obtainedby executing a stacking process, a process of machining a hole, aprocess of filling a conductive material, and the like, for each of thelayers, unlike in the exemplary embodiments described above.

Furthermore, as illustrated in a lower portion of FIG. 10, after theframe 220 is formed, the first support 260 may be removed. In addition,the conductive patterns 221 may be formed by patterning a metal thinfilm 262.

Next, as illustrated in FIG. 11, a first wiring part 210 may be formedon the frame 220. In this case, the first wiring part 210 may be formedon a lower surface of the frame 220 in relation to FIG. 10 and may alsobe seen in FIG. 11, in which the elements of FIG. 10 are shown in areversed state. The first wiring part 210 may include a plurality ofinsulating layers 211, conductive patterns 212, and conductive vias 213.A test jig may be connected to the conductive patterns 212 over thefirst wiring part 210. Next, a second support 265 may be disposed on thefirst wiring part 210, and the second support 265 may include a releaselayer 266 and a metal thin film 267 formed on a surface thereof. Aprocess of forming a through-hole described below may be easily executedby using an additional support 265. However, depending on exemplaryembodiments, the subsequent process may be performed without using thesecond support 265.

Next, as illustrated in FIG. 12, a through-hole H may be formed in theframe using a laser machining or the like. To this end, the structurewhich has been previously obtained may be reversed again. Afterperforming the laser machining, the etch stop layer 264 may be removed.As described above, in the case in which the release layer is interposedbelow the etch stop layer 264, the etch stop layer 264 maybe more easilyremoved. In this case, as described above, when the laser is applied,the existence of the etch stop layer 264 may significantly reduce damageto other components within the package, for example, to the conductivepatterns 212, and the like, and may be retained in a region around thethrough-hole H. In this case, the etch stop layer 264 is not essentialto the present exemplary embodiment, and may be electrically isolatedfrom the electronic component.

The conductive patterns P of the first wiring part 210, exposed byremoving the etch stop layer 264, may be embedded in the insulatinglayer 211. As described above, the embedded patterns P may increasemounting density of the electronic component and may aid in implementingthe slimness of the package.

After a region on which the electronic component is to be disposed isprepared by forming the through-hole H, the electronic component packagemay be implemented using the same processes as the exemplary embodimentdescribed above. Specifically, the electronic component may be disposedin the through-hole H, and may be electrically connected to the embeddedpatterns P. However, the electronic component is not necessarilyconnected to the embedded patterns P, but may also be connected to othertypes of conductive patterns. Next, the electronic component package maybe obtained by forming a molding part, a second wiring part, and thelike. In addition, before completing the package, the second support 265may be removed. In this case, the metal thin film 267 may be patterned.

FIG. 13 is a cross-sectional view schematically illustrating anotherexample of the electronic component package. An electronic componentpackage 100′, according to the present exemplary embodiment, may furtherinclude an additional electronic component 180, unlike the exemplaryembodiment described above. As illustrated in FIG. 13, the electroniccomponent 180 may be embedded in a first wiring part 110′. Theadditional electronic component 180 may correspond to a passive elementhaving a relative small size, for example, a capacitor, or the like,which is not essential to the present exemplary embodiment. An elementmounting area may be reduced by disposing the passive element in thefirst wiring part 110′, thereby reducing a total size of the package. Inaddition, since a current path is shortened by disposing the capacitoror the like in a lower portion of the package, electricalcharacteristics of the package may be improved. In the case in which thepassive element is disposed in the lower portion of the package, anactive element may be disposed in an upper portion of the package. As amethod of burying an electronic component 180 in the first wiring part110′, a method of disposing the electronic component 180, while stackingan insulating layer 111 and covering the electronic component 180 withthe insulating layer 111, may be used. Further, in addition to this, acore accommodating the electronic component 180 may be adopted, and astructure in which the electronic component 180 is embedded may beimplemented by stacking the insulating layers 111 on upper and lowerportions of the core.

As set forth above, according to the exemplary embodiments in thepresent disclosure, the electronic component package according to anexemplary embodiment may be used, whereby a size of the package may bereduced, and manufacturing efficiency may be achieved, even in the casein which the plurality of electronic components are used. In addition,the electrical test may be performed before mounting the electroniccomponents, whereby the manufacturing efficiency may also besignificantly improved. Finally, the manufacturing method of theelectronic component package according to an exemplary embodiment isused, whereby the electronic component package described above may be,again, more efficiently manufactured.

While exemplary embodiments have been shown and described above, it willbe apparent to those skilled in the art that modifications andvariations could be made without departing from the scope of the presentinvention, as defined by the appended claims.

What is claimed is:
 1. An electronic component package comprising: firstand second wiring parts each including an insulating layer, conductivepatterns formed in the insulating layer, and a conductive viapenetrating through the insulating layer, to be connected to theconductive patterns; a frame disposed between the first and secondwiring parts and having conductive connection parts electricallyconnecting one or more through-holes with the first and second wiringparts; and an electronic component disposed in the through-hole, andconnected to the first wiring part, wherein the first wiring partincludes conductive patterns adjacent to the electronic component amongthe conductive patterns of the first wiring part, and the conductivepatterns adjacent to the electronic component are embedded in theinsulating layer of the first wiring part.
 2. The electronic componentpackage of claim 1, further comprising an encapsulant disposed in thethrough-hole.
 3. The electronic component package of claim 1, whereinthe conductive patterns of the first wiring part adjacent to theelectronic component have a smaller pitch than those which are notadjacent to the electronic component.
 4. The electronic componentpackage of claim 1, wherein the electronic component is disposed suchthat an electrode pad included in the electronic component is directedtoward the first wiring part.
 5. The electronic component package ofclaim 1, wherein the frame is formed of a prepreg, and the first andsecond wiring parts include a photo curable material.
 6. The electroniccomponent package of claim 1, wherein the first wiring part is thickerthan the second wiring part.
 7. The electronic component package ofclaim 1, further comprising an adhesive layer interposed between thefirst wiring part and the frame.
 8. The electronic component package ofclaim 7, wherein the adhesive layer is a prepreg or a solder resist. 9.The electronic component package of claim 7, wherein the conductiveconnection part penetrates through the frame, and has a shape in which awidth is decreased from upper and lower surfaces of the frame to aninside of the frame.
 10. The electronic component package of claim 1,further comprising an etch stop layer formed between the first wiringpart and the frame, and in a region around the through-hole.
 11. Theelectronic component package of claim 10, wherein the etch stop layer isformed of a metal, and is electrically isolated from the electroniccomponent.
 12. The electronic component package of claim 10, wherein theframe has a multilayer structure.
 13. The electronic component packageof claim 12, wherein the conductive connection part penetrates througheach of the layers of the frame having the multilayer structure, and theconductive connection part of each of the layers has a shape in which awidth is decreased from an upper portion of the conductive connectionpart to a lower portion thereof.
 14. The electronic component package ofclaim 1, further comprising an additional electronic component embeddedin the first wiring part.
 15. The electronic component package of claim14, wherein the electronic component is an active element, and theadditional electronic component is a passive element.
 16. A method ofmanufacturing an electronic component package, the method comprisingsteps of: preparing a frame including a conductive connection part and athrough-hole; forming a first wiring part including an insulating layer,a conductive pattern and a conductive via on a first support part;bonding the first wiring part to a second support part, and separatingthe first wiring part from the first support part, such that an embeddedpattern is exposed to a surface of the first wiring part; connecting theframe to the first wiring part such that the through-hole is disposed ina region corresponding to the embedded pattern; mounting an electroniccomponent in the through-hole such that the electronic component iselectrically connected to the embedded pattern; removing the secondsupport part; and forming a second wiring part including an insulatinglayer, a conductive pattern and a conductive via on a first support parton the frame.
 17. The method of claim 16, wherein the step of forming afirst wiring part further comprises a step of connecting a test jig tothe conductive pattern of the first wiring part and performing anelectrical test on the first wiring part.
 18. The method of claim 16,further comprising a step of filling the through-hole with anencapsulant after the step of mounting the electronic component in thethrough-hole.
 19. A method of manufacturing an electronic componentpackage, the method comprising steps of: forming an etch stop layer on afirst support; forming a frame including a conductive pattern and aconductive connection part on the first support; removing the firstsupport; forming a first wiring part including an insulating layer, aconductive pattern, and a conductive via on the frame; forming athrough-hole in the frame, such that an embedded pattern in the firstwiring part is exposed; mounting an electronic component in thethrough-hole to be electrically connected to the embedded pattern; andforming a second wiring part including an insulating layer, a conductivepattern, and a conductive via on the frame.
 20. The method of claim 19,further comprising a step of connecting a test jig to the conductivepattern of the first wiring part and performing an electrical test onthe first wiring part.